Integrated solution with grid core 22FDX® technology will reduce power, area and cost of NB-IoT and LTE-M applications
Santa Clara, California, USA and Shanghai, China (July 13, 2017) – Today, GLOBALFOUNDRIES (formerly Grofand) and VeriSilicon announced that they will work together for the next generation of low-power The Wide Area Network (LPWA) introduces the industry's first single-chip IoT solution. The two companies plan to use the core 22FDX® FD-SOI technology to develop a single-chip patent that supports a complete cellular modem module, including integrated baseband, power management, RF, and a front-end that combines narrowband Internet of Things (NB-IoT) with LTE-M capabilities. Module. Compared to existing products, this new solution is expected to significantly improve power consumption, area and cost.
As the number of connected devices in smart city, home and industrial applications increases, network providers are also embarking on new communication protocols to better meet the emerging IoT standards. LPWA technology leverages existing LTE spectrum and mobile communications infrastructure, but focuses more on providing ultra-low power, extended transmission range, and reduced data rates for devices that transmit small amounts of low-frequency data, such as networked water meters and gas meters.
The two leading LPWA connectivity standards include LTE-M, which is promising in the US, and NB-IoT, which has gradually gained a foothold in Europe and Asia. For example, the Chinese government has set NB-IoT as the target for national deployment next year. According to ABI Research, a US market research firm, the combination of the two technologies will drive shipments of cellular M2M modules to nearly 500 million by 2021.
Gexin and VeriSilicon Microelectronics are currently embarking on the development of an IP suite with dual-mode carrier-grade baseband straps with integrated RF front-end modules designed to enable customers to develop cost- and power-optimized single-chip solutions to For global deployment. The design will use the core 22FDX process, using the 22nm FD-SOI technology platform to provide cost-optimized miniaturization and lower power consumption for IoT applications. The 22FDX is the only technology that efficiently integrates RF, transceiver, baseband, processor and power management components on a single chip. Compared to the existing 40nm technology, this integrated solution is expected to achieve an increase of more than 80% in terms of power consumption and die size.
Alain Mutricy, senior vice president of product management at Gexin, said: "Low-power, battery-powered IoT devices are experiencing explosive growth, and 22FDX technology perfectly fits its needs. We are particularly excited about the opportunities that the Chinese market brings. China We are vigorously developing the Internet of Things and smart cities nationwide in a leading position. We are an important partner for us to help us build an FD-SOI ecosystem centered on the new 300mm fab in Chengdu. The cooperation plan will further deepen our long-term partnership."
Dai Weimin, founder, chairman and president of VeriSilicon Co., Ltd. said: "Since five years ago, as a design foundry of Chip Platform as a Service (SiPaaS), VeriSilicon began to develop FD-SOIIP based on FD-SOI. Technology has successfully successfully implemented a variety of chip products. In terms of IoT applications, in addition to cost advantages, integrated RF, body bias and embedded memory such as MRAM are 28mm CMOS process nodes, FD-SOI The key advantages of technology. With the integration of RF and power amplifiers on the grid 22FDX, the baseband and protocol stack can be implemented on an energy-efficient and programmable ZSPnano. ZSPnano is designed for control and data flow with low latency, single cycle Optimized by the signal processing of the instruction. Gexin is located in Chengdu's new FDX 300 mm fab, and the IP platform of the integrated NB-IoT and LTE-M single-chip solutions will be available to China's Internet of Things. And the AIOT (IoT artificial intelligence) industry has a major impact."
Gexin and VeriSilicon are expected to stream and test the test chips based on this integrated solution in the fourth quarter of 2017. Both parties plan to obtain operator licenses in mid-2018.
About the coreGrid is the world's leading full-service semiconductor foundry, providing unique design, development and manufacturing services to the world's most inspiring technology companies. With the development of global production bases across three continents, Gexin has promoted the emergence of technologies and systems that have changed the industry and empowered customers to shape the market. The grid is owned by the Mubadala Development Company. For more information, please visit https://.
About Core MicroelectronicsVeriSilicon Co., Ltd. is a Silicon Platform as a Service (SiPaaS®) provider for mobile connected devices, data centers, Internet of Things (IoT), automotive, industrial and medical devices. A comprehensive system-on-chip (SoC) and system-in-package (SiP) solution is available in a wide range of end markets. VeriSilicon's machine learning and artificial intelligence technologies have comprehensively laid out the future development of smart devices. Based on the SiPaaS service concept, VeriSilicon is the first step in the design and development phase to focus on the core competitive advantages of differentiation. VeriSilicon's one-stop end-to-end solution enables the creation of semiconductor products from definition to test package in a short period of time. The broad and flexible SiPaaS solution provides efficient and economical semiconductor products to a wide range of customers, including emerging and mature semiconductor manufacturers, original equipment manufacturers (OEMs), original design manufacturers (ODMs), and large Internet and cloud platform providers. Alternative solution. VeriSilicon's pixel processing platform from camera input to display/video output is powered by a high-fidelity ISP, embedded visual image processor (VIP) that supports machine learning acceleration, Vivante® low-power GPUs and high-performance GPGPUs, and HantroTM A video codec and a display controller that supports multiple interface standards, these products work together seamlessly to provide optimal PPA (performance, power, and area). In addition, the high-definition audio/voice platform based on the core ZSP® (digital signal processor core) technology and the multi-band multi-mode wireless baseband platform supporting Bluetooth low energy (BLE), Wi-Fi, NB-IoT and 5G technologies are Very low power and extremely high performance applications provide a scalable architecture. The core-added mixed-signal IP portfolio creates an energy-efficient Natural User Interface (NUI) platform that supports voice, gesture and touch interfaces. Founded in 2001, VeriSilicon is headquartered in Shanghai, China and currently employs more than 600 people worldwide. VeriSilicon has five design and development centers and nine sales and customer support offices around the world.
flame retardant polyester braided cable sleeving
PET expandable braided sleeve for cable harness is braided by environment-friendly polyester monofil. (PET,PA66), the sleeve possesses good flexibility, fire resistance, abrasive resistance and thermal insulation performance. The sleeving owns smooth surface, bright color, various patterns.
Application of High Temperature Resistant Cable Sleeve
1. Automobile wires protection
2. Structured cabling system
3.A/V cables & HDMI cables
4.Industrial hoses & tubes protection
Flame Proof Wire Sleeve,Fire Proof Cable Sleeve,High Temperature Braided Sleeve ,Braided Cable Wrap
Shenzhen Huiyunhai Tech.Co.,Ltd , https://www.hyhbraidedsleeve.com