ARM Technology Conference: Xiong "core" enters the Internet of Things (1)

MOSFET imported original FET
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As early as at the ARM TechCon 2014 conference, ARM and its partners demonstrated the latest achievements in chip technology in the fields of mobile devices, Internet of Things and servers. According to the eetimes website report, the author understands that although the ARM SoC has made greater progress, it has not yet reached its golden age, in which the core technology is moving toward the mainstream FinFET technology node, while the Internet of Things and embedded systems continue to expand.

In the face of changing market demands, ARM CEO Simon Segars emphasized at ARM TechCon 2014 that “successful technology is intangible”. Although the size of the chip is getting smaller, connectivity, performance and energy efficiency are more "invisible" to consumers. At the same time, in order to promote the rapid development of hardware and services, such as software-defined networking (SDN), virtualization will effectively reduce complexity and bring more efficient systems to help users' application development.

ARM技术大会:雄“芯”勃勃进军物联网 (1)0

ARM CEO Simon Segars

Expansion to the Internet of Things and the embedded market

With the expansion of IoT applications, ARM introduced the mbed platform to integrate development applications. In this regard, ARM announced a series of new tools, such as Power Grid Architect to simplify the development of grid SoC systems, I understand that the SoC uses the latest "FinFET" 3D transistor technology.

In addition, ARM has expanded its work with TSMC's 10nm process technology. Previous tests using the 16nm FinFET technology on the ARM Cortex-A53 and A57 cores were better than expected. At the same time, the result of cooperation with Synopsys, ARM and Synopsys FinFET-based technology to provide a more advanced ARM V8 core chip.

At ARM TechCon 2014, it not only reflects ARM's comprehensive chip technology, but also demonstrates the wide application range of its solutions in various aspects. By collecting products and technologies on ARM TechCon, it will fully experience the technological innovation brought by ARM chips. .

ARM技术大会:雄“芯”勃勃进军物联网 (1)1

David Detlefsen, senior product manager at Zebra Technologies, showcases a smart wine storage rack controlled by the company's software (picture source eetimes.com, the same below)

ARM技术大会:雄“芯”勃勃进军物联网 (1)2

Mobile market growth

In addition, Erica Kochi, head of the UNICEF Innovation Program at the conference, also said that the growth of the main mobile user market will come from Asia and Africa, especially in emerging markets, which will add nearly 300 million users by 2017. It can be seen that the developing market opportunities are huge, but the demand is different, and the power consumption and cost are more important than the product function.

ARM, which has been eyeing the enterprise market, has demonstrated impressive progress on the server at ARM TechCon 2014. Tom Bradicich, vice president of HP Server Engineering, released the first 64-bit ARM server Moonshot is now shipping, Sandia, USA A research team at the National Laboratory (SNL) has tested all server architectures from the HP Proliant m400 with the Applied Micro X-Gene SoC since March of this year. Initial test results show that performance has improved.

Performance beats Xeon products?

Applied Micro demonstrated its existing 40nm and 28nm X-Gene SoC architecture products, compared to Ivy Bridge and Haswell Xeon processors, and beat Intel in terms of number of requests per second, latency and throughput performance. Although an engineer from Intel said that the results of the live demonstration may take advantage of different sizes, I/O port numbers, or memory channels, the results are not well agreed. However, it is worth noting that the next-generation ARM SoC process can support more 28nm process chips.

ARM技术大会:雄“芯”勃勃进军物联网 (1)3

Compared with xeon performance

ARM技术大会:雄“芯”勃勃进军物联网 (1)4

Server product

Carol Basset, HP Moonshot Product Manager, demonstrated the X-Gene processor board with 64Gb RAM and two 10Gbit/s Ethernet ports. The rack can hold up to 48 boards and two models use Mellanox Ethernet switch boards. In addition, there are 19 Moonshotf server products under development, which will use Intel's first server SoC combined with x86 and GPU.

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