LED package formats have evolved from in-line DIP packages to TOPSMD packages to integrated COB packages and wafer-level CSP packages. With the deepening of high-power LEDs in semiconductor lighting applications, LED packaging technology is becoming more and more powerful and integrated.
For LED package products, packaging materials and package structures are the main factors affecting their performance. Since entering the field of high-power LED light source in 2008, Liyang has undergone continuous performance improvement and technological innovation, from the earliest 1-3W imitation lumen lamp beads to SMD3030 lamp beads to today's flip-chip FE30/FE35 lamps. Beads, the chip of the product is getting smaller and smaller, the reliability is getting better and better, the weather resistance is getting stronger and stronger, the cost performance is getting higher and higher, becoming a dark horse in the field of LED packaging, and boarding the Forbes China non-listed company. Ranked 65th in the list of potential companies. How did Liyang Shares do it?
History of evolution of product innovation technology of Liyang
Adhere to the quality of the fundamental Yangyang light source quality is better than the equivalent performance products
As a company specializing in LED high-power light source products, Liyang has always been committed to actively improving product cost performance, investing a large amount of research and development resources, focusing on R&D and production in the field of flip-chip light sources. At present, the company's flip-chip light source products are already in existence. Product performance and cost performance are significantly better than equivalent performance light source products.
The Liyang CO., Ltd. flip-chip COB series uses a super-thermally conductive ALC aluminum substrate as a substrate and is equipped with a flip chip to realize a new package COB structure. This is a major innovation of the traditional COB structure, which greatly reduces the thermal resistance of the product, and the light source has better thermal conductivity and higher light-emitting structure, and optimizes the heat dissipation structure of the lamp to save the cost of the lamp for the customer. At present, the COB products produced by Liyang Co., Ltd. can achieve 120lm/w or more, and the color rendering index is as high as 90~95. It has passed the LM-80 certification, and the perfect quality control has won the unanimous trust of customers.
Liyang's flip-chip EMC series adopts imported EMC brackets and uses international advanced 3D automatic printing technology to realize the packaging of wafers. The application of flip chip on the EMC bracket platform breaks the tradition, transforms the traditional dressing method into a gold-free flip-chip method, and introduces a world-class fully automated production line, achieving high product production efficiency, low device cost and reliability. High performance, long service life and easy application.
The three major technological innovations have changed from quantitative change to qualitative change.
The conventional high-power device wafer electrode is located on the light-emitting surface, and the bonded gold wire is located above the light-emitting surface to block the light emission of the wafer and reduce the luminous efficacy of the LED. The flip chip electrode used in the flip-chip products of Liyang shares is located at the bottom of the wafer and does not affect the surface light output. The gold-free wire package directly avoids the absorption of light by the gold wire and has higher light extraction efficiency.
Conventional high-power device key alloy wires are prone to problems such as virtual soldering, surge shock, insufficient current resistance, and stress cracking caused by thermal mismatch of package rubber. This is one of the weakest links in the reliability of LED devices. Liyang's flip-chip products have reduced the wire bonding process, improved production efficiency, and completely eliminated various reliability problems caused by bond alloy wires.
Traditional high-power devices generally use insulating glue to fix crystals. The thermal conductivity of insulating rubber is low, which becomes a thermal conduction bottleneck between the wafer and the bracket, which affects LED heat dissipation and long-term reliability. Liyang's flip-chip products use solder materials with tens of times the thermal conductivity of the insulating glue to realize the thermal, electrical and structural interconnection between the wafer electrodes and the support, which not only improves the bonding strength between the product wafer and the support, but also greatly reduces the bonding strength. The thermal resistance of the LED package improves the thermal conductivity of the LED and greatly improves the reliability and longevity of the Liyang light source product.
Active investment in research and development must pay off
Flip-chip LEDs overturn the traditional LED process, from wafer to package, requiring higher equipment input costs. In the case of flip-chip LED packages, solder paste printing requirements are more precise, reflow soldering requirements are higher, LED die bonder accuracy requirements are higher, and professional flip-chip inspection equipment is also required. At present, the Liyang flip-chip LED production line has been mass-produced and imported various products to win the company's future development.
The flip-chip products of Liyang have been widely used in automotive lighting, outdoor lighting and other fields, and the prospects are promising. In the near future, it will replace traditional LED light source products in a wide range of fields such as aeronautical communication, commercial and residential lighting, urban lighting engineering, and road lighting.
Qin Shengyu, executive deputy general manager of Liyang Optoelectronics, said: "Liyang Optoelectronics maintains strong R&D capabilities, adheres to independent technological innovation, and recognizes that product quality is the lifeline of the company's foothold, does not participate in price vicious competition, and insists on a cost-effective product line; Actively introduce automated production lines, and adhere to independent research and development production from industrial chain components such as light source, lens and heat dissipation, ensuring high quality and high cost performance of products, which has been unanimously recognized by domestic and foreign customers. In the future, Liyang Optoelectronics will continue to enhance its own brands. The R&D strength has made the company bigger and stronger, and has become a respected Chinese national brand enterprise."
High-temperature Submersible Motor Winding Wire
This products is made of solid copper wire or enamelled copper wires conductor, crossed-linked polyethylene insulation, optional polyamide jacket. It has fine performance for water-resistant, electric conducting and mechanical. It used to all types water-filled, oil-filled high-temperature submersible motor or similar working electronics, and applied to standard of environmental-friendly.
The conductor is used the standard of GB/T395 or GB/T6109, and applied to JB/T4014 standard.
The product can be used for Voltage 1140V, temperature -40℃-90℃, PH value 6.5-8.5, water pressure 1MPa, light acid-alkali-salt media or oil-media, frequency 50Hz-60Hz, for long time use with stable liability.
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