From the latest US patent issued by the US Patent and Trademark Office, Ultrasonically Welded Structures and Methods for Making the Same, we know that Apple will transform the headphones of iOS devices.
We all know that the headset is made up of different parts, including cables, jacks, microphones, and earpieces, all of which combine to form a complete headset. But for this combination, Apple thinks it's awkward and not beautiful enough.
Apple describes in the patent document how to use ultrasonic welding technology to seamlessly join these parts together. The document describes that the earphones made with the new patent are composed of two different parts, but in the process, the positions of the two parts can be cut or polished or polished. After such processing, the shape of the earphone looks like a "seamless integrated system."
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