ITRI ​​said that because the LED backlight market is no longer in the footsteps of South Korea's Samsung in terms of technology or capacity, the LED backlight market has become a new market opportunity, coupled with the mainland's own huge domestic demand, which has led many companies to Started to actively move towards the lighting market. At the same time, the mainland government has also issued a LED lighting subsidy policy to help out, this year will fully cultivate the growth of local LED brand players, and Taiwan's Epistar suppliers and packaging and testing plants are also expected to benefit.
According to statistics, in 2010, the global LED lighting penetration rate was only 5%. In 2011, the European debt crisis only slightly increased to 6.7%. It is expected that the 2012 penetration rate is expected to be released in the mainland and the LED epitaxial, module Two factors, such as continued price declines, spurred the next move to climb to 9%.
Although the mainland government has clearly stated the proportion of subsidized products and subsidies, it has not announced the maximum amount of LED subsidies. In this regard, ITRI believes that in the future, it is still necessary to regard the order status of mainland LED lighting brand players to know that the subsidy policy is profound to the LED lighting industry. However, in any case, this policy release is undoubtedly broadening LED lighting. The equipment estuary still has positive benefits for the overall LED industry.
Microwave PCB
microwave PCB`s is a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB`s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
The advantages of using materials with a low X, Y and Z CTE is a resulting PCB structure that will remain extremely stable in high temperature environments while operating at up to 40 GHz in analog applications. This allows for the effective placement of very fine pitch components including, in some cases, bare die-attach. Additionally, the low CTE materials will facilitate the alignment of multiple layers and the features they represent in a complex PCB Layout.
Features
.CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
.ER = 3.38/3.48 at 10.0 GHz
.ER is constant to 40.0 GHz
.ED (electro-deposited) copper only
.Layer-to-layer thickness control = +/- 0.001
.Fabrication costs are typical to slightly increased
Microwave PCB
Microwave PCB,Microwave Frequency PCB,Bare Copper Microwave PCB,High Frequency PCB
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