[Text|High-tech LED reporter Xu Chaopeng] In recent years, LED packaging products have been introduced, and COB packaging is increasingly favored by the market for its excellent light color quality, heat dissipation performance, low cost and ease of use. After more than 40 years of development, LED packaging has experienced the development stages of Lamp LED, SMD LED, Power LED, and Integrated COB (Chip on Board).
With the popularization of LED lighting, the application market has further expanded, in the replacement of traditional lamps, especially high-end traditional light sources, such as metal halide lamps, automotive lamps and other markets, the optical, thermal, electrical and mechanical structures of LED packages have been proposed. New and higher requirements, the conventional SMD packaging solution can not be met at this stage, it not only requires high power input high optical density output, but also has strict requirements on light output and light distribution angle. In order to effectively increase power, increase optical density, reduce package thermal resistance, and improve light extraction efficiency, a new technical idea must be adopted for package design.
According to the above market demand, the high-power, high-intensity, small-emitting surface COB products of the same side photoelectricity are successively produced. It is understood that the development process of high power and high optical density COB package has three processes:
1. The densely packed chip layout is adopted, the thermal resistance of the package light source is too large, the reliability of the gold wire connection is low, but the design is flexible and the realization degree is relatively high, which is accepted by the majority COB packaging factory. In order to overcome the shortcomings of the above technology, the packaging factory often makes a fuss about the raw materials, selects the higher thermal conductivity substrate, the solid crystal primer, and adopts many schemes such as heat resistance and thermal stability to encapsulate the silica gel;
2, using vertical chip, excellent thermal resistance, the reliability of the gold wire connection is also low, because of the characteristics of the vertical chip at the bottom of the conductive, the substrate material must be insulating material, basically based on ceramic materials, but on the design line There are a lot of inconveniences, for different driving voltages, it is suitable for designing lines, and it is suitable for standard schemes;
3, using advanced flip-chip technology (Flip-Chip), the biggest advantage of flip-chip COB is no gold wire package, which is much better than the above two processes in reliability. In terms of thermal conductivity, it is superior to the vertical structure. Compared with the above two schemes, the flip-chip COB has the advantages of low voltage, high brightness, high saturation current density, etc. The same chip area, the current ratio of the flip chip can be loaded. Larger than vertical chips. The high power and high optical density COB produced by the flip-chip solution has a maximum power density of 3 to 10 times that of the ordinary COB source. Like the latest flip-chip CF series COB, the highest power density can reach 80W/ with high thermal conductivity desalination aluminum ceramic substrate.
"The same side CF series COB light source has the characteristics of high power and high luminous density. The main light-emitting surface is Φ6mm, Φ9 mm and Φ12 mm. The power range is 12~80W, and the color rendering index is at least 80, which can reach 95 or above. The design condition of the narrow angle beam angle can reach and exceed the light intensity of the corresponding metal halide lamp center, and the energy saving is over 50%. Compared with the conventional COB, the light distribution is full, the light effect is comfortable, and the penetration is good. It is a good choice to replace the metal halide light source." The same party general manager Yang Fan told reporters.
With the popularization of LED lighting, the application market has further expanded, in the replacement of traditional lamps, especially high-end traditional light sources, such as metal halide lamps, automotive lamps and other markets, the optical, thermal, electrical and mechanical structures of LED packages have been proposed. New and higher requirements, the conventional SMD packaging solution can not be met at this stage, it not only requires high power input high optical density output, but also has strict requirements on light output and light distribution angle. In order to effectively increase power, increase optical density, reduce package thermal resistance, and improve light extraction efficiency, a new technical idea must be adopted for package design.
According to the above market demand, the high-power, high-intensity, small-emitting surface COB products of the same side photoelectricity are successively produced. It is understood that the development process of high power and high optical density COB package has three processes:
1. The densely packed chip layout is adopted, the thermal resistance of the package light source is too large, the reliability of the gold wire connection is low, but the design is flexible and the realization degree is relatively high, which is accepted by the majority COB packaging factory. In order to overcome the shortcomings of the above technology, the packaging factory often makes a fuss about the raw materials, selects the higher thermal conductivity substrate, the solid crystal primer, and adopts many schemes such as heat resistance and thermal stability to encapsulate the silica gel;
2, using vertical chip, excellent thermal resistance, the reliability of the gold wire connection is also low, because of the characteristics of the vertical chip at the bottom of the conductive, the substrate material must be insulating material, basically based on ceramic materials, but on the design line There are a lot of inconveniences, for different driving voltages, it is suitable for designing lines, and it is suitable for standard schemes;
3, using advanced flip-chip technology (Flip-Chip), the biggest advantage of flip-chip COB is no gold wire package, which is much better than the above two processes in reliability. In terms of thermal conductivity, it is superior to the vertical structure. Compared with the above two schemes, the flip-chip COB has the advantages of low voltage, high brightness, high saturation current density, etc. The same chip area, the current ratio of the flip chip can be loaded. Larger than vertical chips. The high power and high optical density COB produced by the flip-chip solution has a maximum power density of 3 to 10 times that of the ordinary COB source. Like the latest flip-chip CF series COB, the highest power density can reach 80W/ with high thermal conductivity desalination aluminum ceramic substrate.
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Figure 1 Flip-chip process compared with dress and vertical process
Three process comparisons:
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"The same side CF series COB light source has the characteristics of high power and high luminous density. The main light-emitting surface is Φ6mm, Φ9 mm and Φ12 mm. The power range is 12~80W, and the color rendering index is at least 80, which can reach 95 or above. The design condition of the narrow angle beam angle can reach and exceed the light intensity of the corresponding metal halide lamp center, and the energy saving is over 50%. Compared with the conventional COB, the light distribution is full, the light effect is comfortable, and the penetration is good. It is a good choice to replace the metal halide light source." The same party general manager Yang Fan told reporters.
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The same party general manager Yang Fan
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The same range of CF series ceramic inverted COB products can cover applications such as downlights, spotlights, par lights, orbital spotlights. .jpg)
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CF18-H
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