At present, Yu Sibo combines the concept of LED and the concept of protective components to develop new LED components. It will directly protect the components in the ceramic substrate, no need to add additional protection components, save cost, and reduce the size, reduce the space of LED components by 20%~30%, and develop multi-layer via structure by itself. The heat conduction path reduces the thermal resistance of the LED chip and the ceramic heat dissipation substrate, thereby effectively improving the LED luminous efficiency.
According to the person in charge of Sibo Electronics, the company was established in June 2009 as the first R&D team in Taiwan to integrate semiconductor technology and equipment with passive/protective components based on alumina/aluminum nitride. In 2009, the company has completed the third-generation film professional foundry production line, mainly pushing the thin film ceramic substrate as the heat dissipation substrate of the LED chip. The heat dissipation plate has the following characteristics, low temperature process (below 300 ° C), avoiding high temperature material damage or dimensional variation. Possibility; using the yellow lithography process to make the circuit on the substrate more precise; the metal wire is not easy to fall off, etc., more suitable for high power, small size, high brightness LED.
Now Sibo Electronics is working hard to develop new LED ceramic heat sink substrate manufacturing technology, accelerate the production efficiency of LED products, and maximize the production efficiency of the same production line.
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