Semiconductors are materials between conductors and insulators. Since its formal invention on December 23, 1947, it has been widely used in home appliances, communications, networking, aerospace, aerospace, defense, and other fields, bringing a revolutionary impact on the electronics industry. In 2010, the global semiconductor market reached 298.3 billion U.S. dollars, driving the trillion-dollar electronic product market.
With the growth of the semiconductor market, semiconductor materials have also continued to make breakthroughs. Academician Wang Zhanguo introduced that the Germanium and silicon are generally called the first generation of semiconductor materials. Gallium arsenide, indium phosphide, and the like are called second generation semiconductor materials, and wide band gap silicon carbide, gallium nitride, and diamond are called third generation semiconductor materials.
Among the first-generation materials, 12-inch single-crystal silicon has been produced on a large scale, and 18-inch single-crystal silicon has been successfully developed in the laboratory. The amount of silicon used in integrated circuits worldwide is about 20,000 tons per year. For polysilicon, due to insufficient purity of domestic products, the silicon used in China's integrated circuits is basically imported. In 2011, China’s polysilicon production was 50,000 tons.
In terms of silicon-based microelectronics technology, 8 inches in the world have been widely used in large-scale integrated circuits. There are approximately 38 5 to 12-inch integrated circuit lines in China.
On the technological level, the international 12-inch 45-nanometer process is also put into industrial production, and it is expected that the 16-nanometer process will be developed in 2016. However, our country still stays at the level of 0.18 micron, 90 nanometers, and 65 nanometers. Only a few companies have 45 nanometer technology.
"By 2015, China will have a number of 45- to 90-nanometer 8-inch and 12-inch production lines. In 2022, it will enter the international forefront." Wang Zhanguo said.
However, with the increase in integration, silicon wafers will encounter many difficulties, such as the sharp increase in chip power consumption, it is very likely to melt the silicon.
Internationally, it is expected that by 2022, it will reach the "limit" size of 10 nanometers. Therefore, silicon-based microelectronics technology will ultimately fail to meet the growing demand for information from humans. People are now starting to put hope on developing new semiconductor materials and developing new technologies.
Wang Zhanguo introduced that the second-generation semiconductor materials represented by gallium arsenide (GaAs), indium phosphide (InP), etc. continue to challenge silicon. It can increase the speed of devices and circuits, and solve problems that arise due to increased power consumption due to increased integration.
GaAs, InP and other materials are widely used in satellite communications, mobile communications, optical communications, GPS navigation and other fields. GaAs with a diameter of 2, 4 and 6 inches has been used commercially, and the 8-inch has been successfully developed in the laboratory.
Wang Zhanguo said that the third-generation semiconductor materials represented by gallium nitride, silicon carbide and zinc oxide are also developing rapidly. These materials are wide bandgap semiconductor materials. It has characteristics such as large forbidden band width, high breakdown voltage, large thermal conductivity, fast electron drift velocity, and low dielectric constant, and can be widely used in many fields.
For example, in semiconductor white light lighting, Wang Zhanguo expects that by 2015, China will develop a semiconductor lighting lamp of 150lm/W, the voltage only needs 3 to 4 volts, very safe and energy-saving.
Wang Zhanguo believes that the development trend of semiconductor materials is to develop from three-dimensional body materials to low-dimensional materials. At present, low-dimensional materials based on GaAs and InP-based materials have developed very well and are widely used in the fields of optical communications, mobile communications, and microwave communications.
In fact, these low-dimensional semiconductor materials are also nanomaterials. Wang Zhanguo stated that the application of semiconductor nanoscience and technology will control and manufacture artificial micro-structured materials with powerful and superior performance, and devices and electrical devices and circuits based on them, which are likely to trigger new ones at the atom, molecular, and nanoscale levels. The technological revolution has brought humanity into the unpredictable quantum world.
With the growth of the semiconductor market, semiconductor materials have also continued to make breakthroughs. Academician Wang Zhanguo introduced that the Germanium and silicon are generally called the first generation of semiconductor materials. Gallium arsenide, indium phosphide, and the like are called second generation semiconductor materials, and wide band gap silicon carbide, gallium nitride, and diamond are called third generation semiconductor materials.
Among the first-generation materials, 12-inch single-crystal silicon has been produced on a large scale, and 18-inch single-crystal silicon has been successfully developed in the laboratory. The amount of silicon used in integrated circuits worldwide is about 20,000 tons per year. For polysilicon, due to insufficient purity of domestic products, the silicon used in China's integrated circuits is basically imported. In 2011, China’s polysilicon production was 50,000 tons.
In terms of silicon-based microelectronics technology, 8 inches in the world have been widely used in large-scale integrated circuits. There are approximately 38 5 to 12-inch integrated circuit lines in China.
On the technological level, the international 12-inch 45-nanometer process is also put into industrial production, and it is expected that the 16-nanometer process will be developed in 2016. However, our country still stays at the level of 0.18 micron, 90 nanometers, and 65 nanometers. Only a few companies have 45 nanometer technology.
"By 2015, China will have a number of 45- to 90-nanometer 8-inch and 12-inch production lines. In 2022, it will enter the international forefront." Wang Zhanguo said.
However, with the increase in integration, silicon wafers will encounter many difficulties, such as the sharp increase in chip power consumption, it is very likely to melt the silicon.
Internationally, it is expected that by 2022, it will reach the "limit" size of 10 nanometers. Therefore, silicon-based microelectronics technology will ultimately fail to meet the growing demand for information from humans. People are now starting to put hope on developing new semiconductor materials and developing new technologies.
Wang Zhanguo introduced that the second-generation semiconductor materials represented by gallium arsenide (GaAs), indium phosphide (InP), etc. continue to challenge silicon. It can increase the speed of devices and circuits, and solve problems that arise due to increased power consumption due to increased integration.
GaAs, InP and other materials are widely used in satellite communications, mobile communications, optical communications, GPS navigation and other fields. GaAs with a diameter of 2, 4 and 6 inches has been used commercially, and the 8-inch has been successfully developed in the laboratory.
Wang Zhanguo said that the third-generation semiconductor materials represented by gallium nitride, silicon carbide and zinc oxide are also developing rapidly. These materials are wide bandgap semiconductor materials. It has characteristics such as large forbidden band width, high breakdown voltage, large thermal conductivity, fast electron drift velocity, and low dielectric constant, and can be widely used in many fields.
For example, in semiconductor white light lighting, Wang Zhanguo expects that by 2015, China will develop a semiconductor lighting lamp of 150lm/W, the voltage only needs 3 to 4 volts, very safe and energy-saving.
Wang Zhanguo believes that the development trend of semiconductor materials is to develop from three-dimensional body materials to low-dimensional materials. At present, low-dimensional materials based on GaAs and InP-based materials have developed very well and are widely used in the fields of optical communications, mobile communications, and microwave communications.
In fact, these low-dimensional semiconductor materials are also nanomaterials. Wang Zhanguo stated that the application of semiconductor nanoscience and technology will control and manufacture artificial micro-structured materials with powerful and superior performance, and devices and electrical devices and circuits based on them, which are likely to trigger new ones at the atom, molecular, and nanoscale levels. The technological revolution has brought humanity into the unpredictable quantum world.
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