On April 7, 2011, Texas Instruments (TI) announced today the introduction of the industry's smallest, most efficient buck converter with integrated FETs that can deliver up to 25 A of current for telecommunications, networking, and other applications.
The 25 A, 14 V TPS56221 integrates NexFET MOSFETs for ease of use and is synchronized with SWIFT switching converters to achieve power densities in excess of 200W/in3 and over 90% at high loads from 12 V input to 1.3 V output The efficiency is such that it can provide up to 25 A of continuous output current at 500 kHz switching frequency. The latest TPS56121 15 A, 14 V synchronous switching converters can increase efficiency by 3% from 5 V input to 1.2 V output, and can also increase switching speed by 2 times compared with other similar products.
Sami Kiriaki, senior vice president of TI's Power Management Business Unit, pointed out: "The board-mounted power supplies usually have many circuits and therefore require higher power density and power supply efficiency, especially those systems that operate at higher currents. Both new products are Extends our SWIFT product range to higher current applications, helping our customers achieve breakthroughs in power density, efficiency, and thermal management, resulting in lower power consumption and higher reliability for end equipment Sex."
The TPS56221 and TPS56121 are packaged in a thermally enhanced 5mm x 6mm QFN package, which is 30% smaller than other discrete solutions and is only 315mm2. These devices are the first products to integrate TI NexFET technology to improve thermal performance, protection, efficiency, and reliability. They not only provide three selectable frequencies of 300kHz, 500kHz, and 1MHz for greater design flexibility, but also support a wide input voltage of 4.5V to 14V.
The main features and advantages of TPS56221 and TPS56121:
• High current and high efficiency: With an input voltage of 4.5 V to 14 V, the efficiency can exceed 90% at 25 A and 15 A peak load currents.
Small size and higher power density: The total solution size is only 315 mm2, which minimizes the package while achieving a power density of over 200 W/in3;
NexFET Power Blocks Support Multi-Phase 50 A, 100 A and Higher Currents In addition to the high current performance of SWIFT converters, TI's CSD86350 Q5D NexFET Power Block, introduced last year, enables high-efficiency multi-phase load point designs at higher currents. . The compact 5mm x 6mm stacked MOSFET is housed in a grounded leadframe SON package and supports frequencies up to 1.5 MHz, reducing thermal impedance and simplifying layout. The CSD86350Q5D is more than 90% efficient at 25 A and can be combined with TI's TPS40140 stack controller to support multi-phase designs while maintaining full load efficiency; its current can be extended to 50 A, 100 A, and more high.
An extensive family of step-down converters TI offers the industry's broadest portfolio of buck converters, including FET-integrated DC/DC converters, TPS40KTM DC/DC controllers supporting external MOSFETs, and fully integrated power solutions. Such as the latest TPS84620 integrated inductors.
Availability The TPS56221 and TPS56121 are available in a 22-pin 5mm x 6mm QFN package with a PowerPadTM thermal pad for easy soldering. Samples and evaluation boards will be available at the end of March.
The 25 A, 14 V TPS56221 integrates NexFET MOSFETs for ease of use and is synchronized with SWIFT switching converters to achieve power densities in excess of 200W/in3 and over 90% at high loads from 12 V input to 1.3 V output The efficiency is such that it can provide up to 25 A of continuous output current at 500 kHz switching frequency. The latest TPS56121 15 A, 14 V synchronous switching converters can increase efficiency by 3% from 5 V input to 1.2 V output, and can also increase switching speed by 2 times compared with other similar products.
Sami Kiriaki, senior vice president of TI's Power Management Business Unit, pointed out: "The board-mounted power supplies usually have many circuits and therefore require higher power density and power supply efficiency, especially those systems that operate at higher currents. Both new products are Extends our SWIFT product range to higher current applications, helping our customers achieve breakthroughs in power density, efficiency, and thermal management, resulting in lower power consumption and higher reliability for end equipment Sex."
The TPS56221 and TPS56121 are packaged in a thermally enhanced 5mm x 6mm QFN package, which is 30% smaller than other discrete solutions and is only 315mm2. These devices are the first products to integrate TI NexFET technology to improve thermal performance, protection, efficiency, and reliability. They not only provide three selectable frequencies of 300kHz, 500kHz, and 1MHz for greater design flexibility, but also support a wide input voltage of 4.5V to 14V.
The main features and advantages of TPS56221 and TPS56121:
• High current and high efficiency: With an input voltage of 4.5 V to 14 V, the efficiency can exceed 90% at 25 A and 15 A peak load currents.
Small size and higher power density: The total solution size is only 315 mm2, which minimizes the package while achieving a power density of over 200 W/in3;
NexFET Power Blocks Support Multi-Phase 50 A, 100 A and Higher Currents In addition to the high current performance of SWIFT converters, TI's CSD86350 Q5D NexFET Power Block, introduced last year, enables high-efficiency multi-phase load point designs at higher currents. . The compact 5mm x 6mm stacked MOSFET is housed in a grounded leadframe SON package and supports frequencies up to 1.5 MHz, reducing thermal impedance and simplifying layout. The CSD86350Q5D is more than 90% efficient at 25 A and can be combined with TI's TPS40140 stack controller to support multi-phase designs while maintaining full load efficiency; its current can be extended to 50 A, 100 A, and more high.
An extensive family of step-down converters TI offers the industry's broadest portfolio of buck converters, including FET-integrated DC/DC converters, TPS40KTM DC/DC controllers supporting external MOSFETs, and fully integrated power solutions. Such as the latest TPS84620 integrated inductors.
Availability The TPS56221 and TPS56121 are available in a 22-pin 5mm x 6mm QFN package with a PowerPadTM thermal pad for easy soldering. Samples and evaluation boards will be available at the end of March.
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